Connecting People and Things
through Novel Technologies
to Empower Our Sustainable Digital World

Connecting People and Things
through Novel Technologies
to Empower Our Sustainable Digital World

Connecting People and Things
through Novel Technologies
to Empower Our Sustainable Digital World

Connecting People and Things
through Novel Technologies
to Empower Our Sustainable Digital World

Connecting People and Things
through Novel Technologies
to Empower Our Sustainable Digital World

About us

Advanced Assembly Materials International Ltd. (AAMI) is a global leading lead frame manufacturer offering comprehensive lead frame products & material solutions to the semiconductor packaging industry.

We are formerly the Materials Business Segment under ASM Pacific Technology, operations started in 1980. With the strategic joint-venture between ASM Pacific Technology and Wise Road Capital in 2020, AAMI operates as an independent company the following year with headquarters located in Hong Kong. AAMI have two manufacturing centers in China and Malaysia respectively, and also overseas sales offices to support worldwide customers in the vicinity.




GLOBAL LEADING SUPPLIER

Product & Services

We can design and manufacture products to fit customer needs
because we know assembly process well.









The Successful Entrance Ceremony of Equipment and Facilities of Advanced Assembly Materials Anhui Limited

2021-12-10

On December 10 at 3:18pm, amidst the firecrackers, Advanced Assembly Materials Anhui Limited (AMA) welcome its entrance ceremony of equipment and Facilities.

The Chief Executive Officer of Advanced Assembly Materials International (AAMI), Mr. Ho Shu Chuen, the General Manager of AMA Mr. Lui Kwok Fai, and The Project Head of AMA, Mr. Tang Yong Feng, China Electronics System Engineering No.2 Construction Co., Ltd, Sunyoung Construction Group Co., Ltd , Shenzhen A+E Architectural Engineering Design Co., Ltd, HongYe Supervision Co., Ltd, were all present to witness this important moment.

Both CEO Mr. Ho Shu Chuen and the General Manager of AMA Mr. Lui Kwok Fai were honoured speakers at this event to express their thanks and appreciation to the project's Main Contractor, Design Team and Project Management Team as key members of the project collaborators in taking part in the entire engineering scope and in their important contributions. They also further thanked them for their key efforts from the time when they first received the preliminary approvals, at the topping off ceremony which marked the entry of AMA into a new phase which brought it closer to its being a successful investment. Mr. Yang Deng Lu, China Electronics Engineering Second Construction Co., Ltd, Mr. Gong Jian Jun, the General Manager of Sunyoung Construction Group Co., ltd, Mr. Yin Ming , Shenzhen A+E Architectural Engineering Design Co., Ltd, all gave their warm congratulations to AMA.

The current progress of AMA is also due to the all the hard work of these partners and our co-workers at AAMI together with their hard efforts and in our ongoing efforts to keep our commitment to values of MAKE IT RIGHT, MAKE IT HAPPEN, MAKE IT BETTER, MAKE IT TOGETHER and to enable the orderly progress to help AMA to start become a valuable contributor and to be global number 1 lead frame supplier in terms of both financial and ESG performance.

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Connecting People and Things
through Novel Technologies
to Empower Our Sustainable Digital World

Along with the continuous improvement of semiconductor manufacturing capability, the application of its product 「Integrated Circuits (IC)」 becomes more and more popular.
However, no matter how powerful an IC chip itself, it still needs to work together with other chips carrying different functions so as to fully perform.

In electronic world, the mission of Lead Frame is to connect different ICs to form functional module, sub-system, and even an entire giant and complicated system.

Although lead frame is just a piece of metal strip, through unremitting efforts & innovation, we keep adding values to our lead frame products. They can well connect tremendous ICs reliably, enable to connect people and things through novel technologies to empower our sustainable digital world, making our life better than ever!



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