CEO MESSAGE

Thank you for your continued trust and support.

Over the past four decades, as a business segment under ASM Pacific Technology, we have established a strong foundation in lead frame design, materials engineering, and precision manufacturing. These strengths have shaped us into a leading global supplier of lead frames. Our technological heritage continues to guide our capabilities and strategic direction.

Since our spin-off in 2021, Advanced Assembly Materials International Limited (AAMI) has successfully transitioned into an independent organization. We have maintained stable execution, operational resilience, and sustained growth. Our ability to operate autonomously while maintaining excellence in quality, process control, and customer delivery reflects the strength of our technology, engineering culture and manufacturing discipline.

Amid the restructuring of global semiconductor supply chains, AAMI has proactively expanded its manufacturing footprint. We have significantly increased capacity in Chuzhou, China and Johor, Malaysia, to establish a dual-region manufacturing strategy. AAMI is the first lead frame supplier to systematically develop both stamping and etching capabilities both within China and abroad. This enables our customers to diversify sourcing strategies, and strengthen supply chain resilience in today’s complex geopolitical environment.

At the core of AAMI’s competitiveness is our continuous investment in advanced materials and process technologies. We have developed fine-pitch lead frame design that supports higher I/O density and miniaturization. Our advanced etching and stamping technologies ensure tight dimensional tolerances and high consistency at scale.

AAMI is also advancing plating technologies. Our multi-layer and selective plating processes, including silver, nickel-palladium-gold (NiPdAu) and other surface finishes, are engineered for excellent package reliability. These capabilities are essential for achieving robust interconnect performance under increasingly demanding operating conditions characterized by high current densities and elevated thermal loads.

The rapid advancement of artificial intelligence is driving a new wave of semiconductor innovation in high-performance computing, data centers, and advanced packaging architectures. Our technologies play a vital role in enabling efficient power delivery, effective heat dissipation, and long-term reliability in AI chips, application and systems.

AAMI is entering a new phase of growth through strategic asset restructuring. We are becoming a major subsidiary of Shenzhen Original, a Shanghai-listed company. This transformation enhances our access to capital, R&D resources, and industrial synergies. It will enable us to accelerate innovation, strengthen our materials science capabilities, and expand into adjacent areas of the semiconductor value chain.

Looking ahead, AAMI remains steadfast in advancing our core technologies in materials engineering, precision manufacturing, and packaging solutions. We will continue to work closely with our customers to address the growing complexity of semiconductor design, particularly in high-growth sectors such as artificial intelligence, automotive electronics, and next-generation communication systems.

We sincerely thank our customers, stakeholders, and employees for their continued trust and partnership. Together, we will continue to pioneer new frontiers of innovation and define the future of semiconductor materials and packaging.

Thank you.