Micro-etching (ME-2)
Brown Oxide treatment is field proven and well-known MSL1 lead frame surface treatment. However, it cannot be applied to full-coverage NiPdAu pre-plated frame for no Cu surface exposed. Considering palladium (Pd) and gold (Au) are noble metals, i.e. chemical inert, mechanical surface roughening becomes preferred adhesion mechanism for PPF. In ME-2, the micro-scale dimples are made on lead frame surface with different tilting angles, such that the molten-state EMC penetrate and solidified inside the dimples, creating very strong 3D mechanical interlocking. Furthermore, the dimples in micro-scale allow to bond wires on top of it. This direct-bondable nature makes the assembly process compatible with regular lead frame.
Selective ME-2 Treatment
With the advancement of our technology, we have responded to the needs of some customers by using mechanical masks to cover different areas to achieve selective ME-2 surface treatments. The advantage is that it can effectively reduce the risk of encapsulation molding compound (EMC) mold flash on the external leads in the package assembly process. In addition, we can also make the top and bottom of the lead frame have different selective roughening areas, which not only improves the design flexibility, but also improves the uniformity of the micro-dimple distribution.
GLOBAL LEADING SUPPLIER
Product & Services
We can design and manufacture products to fit customer needs
because we know assembly process well.
because we know assembly process well.
MSL Solutions
|
Surface Finishing
|
||
QFN solutions
|
Power Device solutions
|
Cost Effective HD LF
|
Value Added Services
|
