Mini Dimple Technology (MDT)

Surface roughening is a very popular method adopted to promote mechanical (interlocking) adhesion between lead frame to encapsulation molding compound (EMC) and die attach glue, for the sake of enhance package reliability. To some very price-sensitive products while packaged in QFN format, a low-cost selective roughening lead frame surface treatment developed by us is a good news to them.

The characteristics of this mini-dimples is of size 60~70μm and min spacing at 25μm. Comparing with conventional dimple of size 100~150μm & 100μm spacing, this mini-dimple can be selectively applied on very smaller areas than ever just like in-between chips, chip-to-pad-edge, lead-end-to-pkg-edge, etc., addressing to those regional delamination areas. This MDT is incorporated into etching line not requiring a dedicated stand-alone equipment, thus making it cost-competitive by nature.