Super Strong Anti-tarnish (SSAT) For Multi Chip Module Packaging
The idea of Multi Chip Module (MCM) is to put different semiconductor chips possibly made by different companies, technologies or materials into a single package for better cost-performance (cost, space reduction), flexibility, time-to-market, etc. Its application is not limited to advanced packaging, but also QFN featuring with multi-pads. The multiple die attach (thermal curing) processes would cause significant surface oxidization over copper-based lead frame. This uncontrolled copper oxide layer is one of the key contributor to package delamination, resulting in reliability failure. Conventional or popular anti-tarnish chemical is designed for one-time single die attach curing process, thus insufficient protection against multiple-process. In view of market trend, we have developed a super string anti-tarnish treatment to strongly elevate the lead frame anti-tarnish capability, and it can also be tailor-made to fit for different thermal loading requirements.
Product & Services
because we know assembly process well.