QFN Backside Taping

When the industry started QFN packaging, considering the handling rigidity, support tape was adhered to the backside of QFN lead frame aimed at facilitating wire bonding process and eliminating molding flash in encapsulation process. Silicon-based adhesive tape has been the most popular selection due to it relatively lower price. However, its adhesive residue remained after encapsulation has been a concern to exposed I/O surface plating and SMT. The development of the thermal plastic tape at later stage did solve the adhesive residue problem, but its high cost limits its popularity. These technical & cost challenges provide room for various players to offer different types of tape with different physical properties fighting for the market. These tapes need different taping processes, and thus specialized taping machine. Taking the leverage of ASM Equipment design & manufacturing resources; while integrating our taping experiences and know-how via DoE, we developed our own taping machines not simply to adhere properly, but also with excellent quality in terms of adhesion strength, minimal warpage, high cleanliness, etc.