Laser Marking with e-Mapping
In an effort to reduce leadframe scrap, AAMI has introduced laser marking. The printed QR code contains information that points out the location of defects on a strip. This additional service can be applied to any type of surface finish, and the screening criteria are in accordance with customer requirements. Here is our process flow for eliminating leadframes with low defects
QFN Backside Taping
When the industry started QFN packaging, considering the handling rigidity, support tape was adhered to the backside of QFN lead frame aimed at facilitating wire bonding process and eliminating molding flash in encapsulation process. Silicon-based adhesive tape has been the most popular selection due to it relatively lower price. However, its adhesive residue remained after encapsulation has been a concern to exposed I/O surface plating and SMT. The development of the thermal plastic tape at later stage did solve the adhesive residue problem, but its high cost limits its popularity. These technical & cost challenges provide room for various players to offer different types of tape with different physical properties fighting for the market.
These tapes need different taping processes, we developed our own taping machines not simply to adhere properly, but also with excellent quality in terms of adhesion strength, minimal warpage, high cleanliness, etc.
Product & Services
because we know assembly process well.