Our extensive product portfolio
Lead Frame is the most popular and economical circuit material for semiconductor chip assembly.
Its value propositions to package assembly include being a mechanical carrier for assembly, an electrical signal connection between semiconductor chip and PCB, and a thermal dissipation path from the chip to the ambient. The basic structure of a Lead Frame is relatively simple, which is a made of highly-conductive high-strength metal alloy. The circuit pattern is made by high-speed mechanical stamping or high-precision chemical etching. Precious noble metal, silver as an example, is plated on selected portions to enable interconnection bonding.
We are able to offer One-stop Solution to customers
Our extensive product portfolio covers stamped & etched lead frames; with Ag or Ni/Pd/Au plating, or bare copper; IC package or LED pre-molded, etc.. Our lead frame products are widely used in different end applications, covering computing, communications, consumers, industrial, and even automotive. The patented proprietary surface roughening technologies, namely Brown Oxide Treatment (BOT) and Micro-etching 2 (ME-2), enable MSL1 package reliability standard and well accepted in the market. For cost-competitive solution, we are the first supplier to offer 100x300mm large-strip high-density lead frame. Coupled with ASM assembly process know-how and equipment capability, we are able to offer One-stop Solution to customers.
Our Innovations to Create New Competitive Advantages
Product & Services
because we know assembly process well.