Power Device Solutions

Lead frames play a crucial role in power semiconductor packaging as they serve as mechanical supports, thermal paths, and electrical interconnections for devices, thereby improving performance and reliability. They can have different designs based on application requirements, including power dissipation, current handling, reliability, and cost.

One common design variation for power package lead frames is the single- and dual-gauge base material. It refers to the lead frame base material thickness in different regions. In a single-gauge design, the lead frame has a uniform thickness throughout. Conversely, a dual-gauge design incorporates a thicker metal in the die attach area as heatsink and a thinner metal in the lead fingers area. The dual gauge design aims at minimizing thermal stress and consequently enhancing package reliability.

IPM

IPM lead frames are specifically tailored to meet the requirements of Intelligent Power Modules, delivering optimal electrical performance, thermal management, and mechanical reliability. Their design and construction enable the efficient integration of power semiconductor devices and control circuitry into a compact and robust package. AAMI is able to offer an IPM lead frame with multiple die attach pads, each with different down set depths. Besides, several plating options are available for selection. This flexibility allows for customization and adaptation to specific module designs and requirements.

QFN with Top Exposed DAP

The Power QFN (Quad Flat No-lead) with a top-exposed pad is an upgraded version of regular QFN that offers high thermal and electrical performance for power devices. This novel design allows for heat dissipation through convection to the ambient air. The presence of an external cooling system with direct attachment to the die attach pad can further enhance heat dissipation efficiency. Additionally, the Power QFN with a top-exposed pad is compatible with standard QFN footprints and assembly processes, making it easy to integrate into existing designs.

Power Discrete

Power discrete lead frames are specifically designed for use in power semiconductor devices, including power supplies, motor drives, automotive electronics, renewable energy systems, and industrial equipment. These lead frames play a crucial role in providing mechanical support, electrical interconnections, and thermal dissipation for power discrete components such as power diodes, power transistors, etc. Typically, thin single-gauge copper alloy is used in small power rating device while thick or even dual-gauge copper alloy is used for medium to high power rating. At AAMI, we currently offer wide variety open tools for power package lead frames: SOT23, SC70, TO247, TO220, T2PAK, etc.